02030206| Datasheet

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Surface Mounting Instructions for Chip, Array and Feedthrough Capacitors Surface mounting instructions
1 1.1 Terminations Nickel-barrier termination
Termination (nickel barrier) Ceramic body

Inner electrode

NME AgPd

BME Ni

Substrate electrode Intermediate electrode External electrode

NME Ag Ni Sn

BME Cu Ni Sn

NME: Noble Metal Electrode BME: Base Metal Electrode
KKE0485-5-E

As shown in the diagram above, the terminations consist of three metallic layers. A primary silver or copper layer with high conductivity provides good electrical contact. "Leaching" of the silver/copper is prevented by a nickel-barrier layer. The outer tin coating prevents corrosion of the nickel and ensures good component solderability. Nickel-barrier termination is standard for chips (case size 0402, 0603, 0805, 1206, 1210), arrays (case size 0405, 0508 and 0612) and feedthrough capacitors. 1.2 Silver-palladium termination
Ceramic body Termination

Inner electrode

AgPd

External electrode

AgPd
KKE0487-L

Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips intended for conductive adhesion. This metallization improves the resistance of large chips to thermal shock. In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corrosion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid applications as well.

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