July 1997
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July 1997
FDC6304P Digital FET, Dual P-Channel
General Description
These P-Channel enhancement mode field effect transistor are produced using Fairchild s proprietary, high cell density, DMOS technology. This very high density process is tailored to minimize on-state resistance at low gate drive conditions. This device is designed especially for application in battery power applications such as notebook computers and cellular phones. This device has excellent on-state resistance even at gate drive voltages as low as 2.5 volts.
Features
-25 V, -0.46 A continuous, -1.0 A Peak. RDS(ON) 1.5 VGS -2.7 V RDS(ON) 1.1 VGS -4.5 V. Very low level gate drive requirements allowing direct operation in 3V circuits. VGS(th) 1.5 V. Gate-Source Zener for ESD ruggedness. 6kV Human Body Model.
SOT-23
SuperSOTTM-6 Mark: .304
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
4
3
5
2
6
1
Absolute Maximum Ratings
Symbol VDSS VGSS ID PD TJ,TSTG ESD Parameter Drain-Source Voltage Gate-Source Voltage Drain Current
TA 25oC unless other wise noted FDC6304P -25 -8 Units V V A
- Continuous - Pulsed
-0.46 -1
(Note 1a) (Note 1b)
Maximum Power Dissipation
0.9 0.7 -55 to 150 6.0
W
Operating and Storage Temperature Range Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf / 1500 Ohm)
C kV
THERMAL CHARACTERISTICS RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 1a) (Note 1)
140 60
C/W C/W
FDC6304P Rev.D
1997 Fairchild Semiconductor Corporation
FDC6304P Datasheet Fairchild Download PDF
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