FQD7P06

FQD7P06 / FQU7P06

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FQD7P06 / FQU7P06

May 2001

QFET
FQD7P06 / FQU7P06
60V P-Channel MOSFET
General Description
These P-Channel enhancement mode power field effect transistors are produced using Fairchild s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. These devices are well suited for low voltage applications such as automotive, DC/DC converters, and high efficiency switching for power management in portable and battery operated products.

TM

Features
-5.4A, -60V, RDS(on) 0.45 VGS -10 V Low gate charge ( typical 6.3 nC) Low Crss ( typical 25 pF) Fast switching 100% avalanche tested Improved dv/dt capability

S D G

G

S

D-PAK
FQD Series

I-PAK
G D S
FQU Series

D

Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD

TC 25 C unless otherwise noted

Parameter Drain-Source Voltage - Continuous (TC 25 C) Drain Current - Continuous (TC 100 C) Drain Current - Pulsed
(Note 1)

FQD7P06 / FQU7P06 -60 -5.4 -3.42 -21.6 25
(Note 2) (Note 1) (Note 1) (Note 3)

Units V A A A V mJ A mJ V/ns W W W/ C C C

Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA 25 C) Power Dissipation (TC 25 C)

90 -5.4 2.8 -7.0 2.5 28 0.22 -55 to 150 300

TJ, TSTG TL

- Derate above 25 C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds

Thermal Characteristics
Symbol RJC RJA RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient Typ ---Max 4.5 50 110 Units C/W C/W C/W

When mounted on the minimum pad size recommended (PCB Mount)
2001 Fairchild Semiconductor Corporation Rev. A2. May 2001

FQD7P06 Datasheet Fairchild Download PDF

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