FQI34P10

FQB34P10 / FQI34P10

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FQB34P10 / FQI34P10

QFET
FQB34P10 / FQI34P10
100V P-Channel MOSFET
General Description
These P-Channel enhancement mode power field effect transistors are produced using Fairchild s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as audio amplifier, high efficiency switching DC/DC converters, and DC motor control.

Features
-33.5A, -100V, RDS(on) 0.06 VGS -10 V Low gate charge ( typical 85 nC) Low Crss ( typical 170 pF) Fast switching 100% avalanche tested Improved dv/dt capability 175 C maximum junction temperature rating

S D G

D2-PAK
FQB Series

I2-PAK
G D S
FQI Series

Absolute Maximum Ratings
Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD

TC 25 C unless otherwise noted

Parameter Drain-Source Voltage - Continuous (TC 25 C) Drain Current - Continuous (TC 100 C) Drain Current - Pulsed
(Note 1)

FQB34P10 / FQI34P10 -100 -33.5 -23.5 -134 25
(Note 2) (Note 1) (Note 1) (Note 3)

Units V A A A V mJ A mJ V/ns W W W/ C C C

Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA 25 C)

2200 -33.5 15.5 -6.0 3.75 155 1.03 -55 to 175 300

TJ, TSTG TL

Power Dissipation (TC 25 C) - Derate above 25 C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds

Thermal Characteristics
Symbol RJC RJA RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient Typ ---Max 0.97 40 62.5 Units C/W C/W C/W

When mounted on the minimum pad size recommended (PCB Mount)

2004 Fairchild Semiconductor Corporation

Rev. B, June 2004