HUF75631SK8

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HUF75631SK8
Data Sheet December 2001

5.5A, 100V, 0.039 Ohm, N-Channel, UltraFET Power MOSFET Packaging
JEDEC MS-012AA
BRANDING DASH

Features
Ultra Low On-Resistance - rDS(ON) 0.039, VGS 10V Simulation Models - Temperature Compensated PSPICE and SABERTM Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com Peak Current vs Pulse Width Curve UIS Rating Curve
DRAIN (8) DRAIN (7) DRAIN (6) DRAIN (5)

5 1 2 3 4

Symbol
SOURCE (1) SOURCE (2) SOURCE (3) GATE (4)

Ordering Information
PART NUMBER HUF75631SK8 PACKAGE MS-012AA BRAND 75631SK8

NOTE: When ordering, use the entire part number. Add the suffix T to obtain the variant in tape and reel, e.g., HUF75631SK8T.

Absolute Maximum Ratings

TA 25oC, Unless Otherwise Specified HUF75631SK8 UNITS V V V A A 100 100 20 5.5 3.5 Figure 4 Figures 6, 14, 15 2.5 20 -55 to 150 300 260 W mW/oC
oC oC oC

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TA 25oC, VGS 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TA 100oC, VGS 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg NOTES: 1. TJ 25oC to 150oC. 2. 50oC/W measured using FR-4 board with 0.76 in 2 (490.3 mm2) copper pad at 10 second. 3. 152oC/W measured using FR-4 board with 0.054 in 2 (34.8 mm2) copper pad at 1000 seconds 4. 189oC/W measured using FR-4 board with 0.0115 in 2 (7.42 mm2) copper pad at 1000 seconds

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html For severe environments, see our Automotive HUFA series. All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.

2001 Fairchild Semiconductor Corporation

HUF75631SK8 Rev. B