HUF76407D3S

HUF76407D3, HUF76407D3S

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HUF76407D3, HUF76407D3S
Data Sheet December 2001

11A, 60V, 0.107 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging
JEDEC TO-251AA
DRAIN (FLANGE) SOURCE DRAIN GATE GATE SOURCE

JEDEC TO-252AA
DRAIN (FLANGE)

Features
Ultra Low On-Resistance - rDS(ON) 0.092, VGS 10V - rDS(ON) 0.107, VGS 5V Simulation Models - Temperature Compensated PSPICE and SABERTM Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com Peak Current vs Pulse Width Curve UIS Rating Curve Switching Time vs RGS Curves

HUF76407D3

HUF76407D3S

Symbol
D

Ordering Information
S

PART NUMBER HUF76407D3 HUF76407D3S

PACKAGE TO-251AA TO-252AA

BRAND 76407D 76407D

NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-252AA variant in tape and reel, e.g., HUF76407D3ST.

Absolute Maximum Ratings

TC 25oC, Unless Otherwise Specified HUF76407D3, HUF76407D3S 60 60 16 11 12 6 6 Figure 4 Figures 6, 14, 15 38 0.25 -55 to 175 300 260 UNITS V V V A A A A

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TC 25oC, VGS 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC 25oC, VGS 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC 135oC, VGS 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC 135oC, VGS 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . .IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg NOTE: 1. TJ 25oC to 150oC.

W W/oC oC
oC oC

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

For severe environments, see our Automotive HUFA series.

2001 Fairchild Semiconductor Corporation

HUF76407D3, HUF76407D3S Rev. B