DS_91803_LaneLink4x-neu-RZ| Datasheet

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Features and Benefits

0.50 mm (.020") Pitch LaneLinkTM 4x Receptacle 91803 Jackscrew Receptacle 91804 Latch Receptacle 91789 EMI Rear Shield

5 GHZ Bi-directional 4 Lane I/O Connector System with Superior Mechanical Reliability The Molex 4 Lane I/O connectors incorporate an industry compatible mating interface compliant with InfiniBandTM requirements. This I/O system has also been adopted by several other standards or MSA groups in addition to InfiniBandTM, noted below. LaneLinkTM is a 100 ohm cable to board I/O system optimized for differential signaling at 2.5 Gbps per pair. The Molex design features superior mechanical reliability and an extensive range of options including Latching and Jackscrews versions. A recent feature to both 4x options is the addition of a landing area for automated Pick and Place. EMI shielding has now been improved by adding a rear EMI shield to reduce EMC/EMI leakages.

Features / Receptacle Die cast frame with unitary latch posts and screw attach to PCB Optional top mount attach of die cast frame to chassis Dedicated pick and place landing area Solder post options (2 or 4 posts) Various PCB thickness accommodated High level of pin to PCB compliancy Extended crush pin alignment posts Jackscrew option complies with SFF-8470

Benefits Provides the best available strain relief of cable to socket and isolates cable loads from SMT tails Additional strain relief Allows use of standard pick and place nozzles Replaces need for screw down Allows customer to use various PCB options Helps coplanarity Eases alignment of connector to board

SPECIFICATIONS Reference Information Packaging: Tray, Tape and Reel Mates With: 91804 to 91635; 91803 to 91659; 91789 to 91803 or 91804 Designed In: Millimeters Electrical Voltage: 30 V AC max Current: 0.5 A max Contact Resistance: 80 milliohms Dielectric Withstanding Voltage: 300 V AC Insulation Resistance: 1000 Megohms Mechanical Contact Retention to Housing: 5N (1.12 lb) min Mating Force: 55.5N (12.33 lb) max for 4x; 73N (16.37 lb) max for 12x Unmating Force: 7.0N (1.57 lb) min for 4x; 10.5N (2.35 lb) min for 12x; 49.0N (10.99 lb) max for 4x; 59.0N (13.23 lb) min for 12x Durability: 250 cycles Physical Housing: LCP, UL 94V-0 Contact: Phosphor Bronze Plating: Contact Area Gold over Palladium Nickel Solder Tail Area Tin Underplating Nickel PCB Thickness: 1.60 mm (.063"), 2.40 mm (.094"), 4.00 mm (.157") Operating Temperature: 20 to 60 C

Latch

Jackscrew