MBRS260T3-D| Datasheet

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MBRS260T3 Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
Features http://onsemi.com

SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 60 VOLTS

Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guard-Ring for Over-Voltage Protection Low Forward Voltage Drop Pb-Free Package is Available

Mechanical Characteristics

SMB CASE 403A PLASTIC

Case: Molded Epoxy Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 95 mg (Approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable ESD Ratings: Machine Model = C Human Body Model = 3B

MARKING DIAGRAM

AYWW B26G G B26 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)

MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 95 C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25 C) Symbol VRRM VRWM VR IO IFSM Value 60 Unit V

ORDERING INFORMATION
Device MBRS260T3 Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel

2.0 60

A A

MBRS260T3G

Tstg, TC TJ dv/dt

-55 to +150 -55 to +125 10,000

C C V/ms

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Semiconductor Components Industries, LLC, 2008

January, 2008 - Rev. 3

Publication Order Number: MBRS260T3/D