MJE15032-D| Datasheet

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MJE15032 (NPN), MJE15033 (PNP)
Preferred Devices

Complementary Silicon Plastic Power Transistors
Designed for use as high-frequency drivers in audio amplifiers.
Features http://onsemi.com

DC Current Gain Specified to 5.0 Amperes
hFE = 70 (Min) @ IC = 0.5 Adc = 10 (Min) @ IC = 2.0 Adc Collector-Emitter Sustaining Voltage - VCEO(sus) = 250 Vdc (Min) - MJE15032, MJE15033 High Current Gain - Bandwidth Product fT = 30 MHz (Min) @ IC = 500 mAdc TO-220AB Compact Package Epoxy Meets UL 94 V-0 @ 0.125 in ESD Ratings: Machine Model C Human Body Model 3B Pb-Free Packages are Available*

8.0 AMPERES POWER TRANSISTORS COMPLEMENTARY SILICON 250 VOLTS, 50 WATTS
MARKING DIAGRAM
4
A YW MJE1503xG AKA

MAXIMUM RATINGS

TO-220 CASE 221A STYLE 1

Rating Symbol VCEO VCB VEB IC IB Value 250 250 5.0 8.0 16 2.0 Unit Vdc Vdc Vdc Adc Adc Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous - Peak Base Current Total Power Dissipation @ TC = 25_C Derate above 25_C Total Power Dissipation @ TA = 25_C Derate above 25_C Operating and Storage Junction Temperature Range PD PD 50 0.40 W W/_C W W/_C _C 2.0 0.016 TJ, Tstg 65 to + 150

3 MJE1503x = Specific Device Code x = 2 or 3 A = Assembly Location Y = Year W = Work Week G = Pb-Package

ORDERING INFORMATION
Device MJE15032 MJE15032G MJE15033 MJE15033G Package TO-220 TO-220 (Pb-Free) TO-220 TO-220 (Pb-Free) Shipping 50 Units/Rail 50 Units/Rail 50 Units/Rail 50 Units/Rail

THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Case

Symbol RqJC RqJA

Max 2.5

Unit

_C/W _C/W

Thermal Resistance, Junction-to-Ambient

62.5

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.

*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005

June, 2005 - Rev. 3

Publication Order Number: MJE15032/D