MURHF860CT-D| Datasheet

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MURHF860CT
Preferred Device

SWITCHMODEt Power Rectifier
These stateoftheart SWITCHMODE power rectifiers are designed for use in switching power supplies, inverters and as free wheeling diodes.
http://onsemi.com Features

Ultrafast 35 Nanosecond Recovery Times 150 C Operating Junction Temperature Electrically Isolated. No Isolation Hardware Required Epoxy Meets UL 94 V-0 @ 0.125 in High Temperature Glass Passivated Junction High Voltage Capability to 600 V Low Leakage Specified @ 150 C Case Temperature Pb-Free Package is Available*

ULTRAFAST RECTIFIER 8.0 AMPERES, 600 VOLTS
3 2 1

MARKING DIAGRAM

Mechanical Characteristics:

Case: Epoxy, Molded Weight: 1.9 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable

Lead Temperature for Soldering Purposes: 260 C Max for 10 Seconds
MAXIMUM RATINGS (Per Leg)
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 120 C) Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 120 C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFM Value 600 Unit V 1 2 3 ISOLATED TO-220 CASE 221D STYLE 3

AYWW UH860G AKA

4.0 8.0 16

A A

IFSM

100

A Y WW UH860 G AKA

= Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity

TJ, Tstg

- 65 to +150

ORDERING INFORMATION
Device MURHF860CT Package TO-220 TO-220 (Pb-Free) Shipping 50 Units/Rail 50 Units/Rail

THERMAL CHARACTERISTICS (Per Leg)
Rating Max Thermal Resistance, Junction-to-Case Symbol RqJC Value 4.1 Unit C/W

MURHF860CTG

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Preferred devices are recommended choices for future use and best overall value.

*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2007

June, 2007 - Rev. 5

Publication Order Number: MURHF860CT/D