NGB8204N-D| Datasheet

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NGB8204N Ignition IGBT 18 Amps, 400 Volts
N-Channel D2PAK
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features monolithic circuitry integrating ESD and Overvoltage clamped protection for use in inductive coil drivers applications. Primary uses include Ignition, Direct Fuel Injection, or wherever high voltage and high current switching is required.
Features http://onsemi.com

18 AMPS, 400 VOLTS VCE(on) 3 2.0 V @ IC = 10 A, VGE . 4.5 V
C

Ideal for Coil-on-Plug Applications Gate-Emitter ESD Protection Temperature Compensated Gate-Collector Voltage Clamp Limits

Stress Applied to Load Integrated ESD Diode Protection New Design Increases Unclamped Inductive Switching (UIS) Energy Per Area Low Threshold Voltage to Interface Power Loads to Logic or Microprocessor Devices Low Saturation Voltage High Pulsed Current Capability Integrated Gate-Emitter Resistor (RGE) Emitter Ballasting for Short-Circuit Capability Pb-Free Package is Available

G RGE

E D2PAK CASE 418B STYLE 4

MARKING DIAGRAM
4 Collector GB 8204NG AYWW 1 Gate GB8204N A Y WW G 3 Emitter 2 Collector = Device Code = Assembly Location = Year = Work Week = Pb-Free Package

MAXIMUM RATINGS (TJ = 25 C unless otherwise noted)
Rating Collector-Emitter Voltage Collector-Gate Voltage Gate-Emitter Voltage Collector Current-Continuous @ TC = 25 C - Pulsed ESD (Human Body Model) R = 1500 W, C = 100 pF ESD (Machine Model) R = 0 W, C = 200 pF Total Power Dissipation @ TC = 25 C Derate above 25 C Operating and Storage Temperature Range Symbol VCES VCER VGE IC ESD ESD PD TJ, Tstg Value 430 430 18 18 50 8.0 800 115 0.77 -55 to +175 Unit VDC VDC VDC ADC AAC kV V W W/ C C

ORDERING INFORMATION
Device NGB8204NT4 NGB8204NT4G Package D2PAK D2PAK (Pb-Free) Shipping 800 / Tape & Reel 800 / Tape & Reel

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2006

August, 2006 - Rev. 3

Publication Order Number: NGB8204N/D