NST847BPDP6-D| Datasheet

NST847BPDP6-D| Datasheet

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NST847BPDP6T5G Dual Complementary General Purpose Transistor
The NST847BPDP6T5G device is a spin-off of our popular SOT-23/SOT-323/SOT-563 three-leaded device. It is designed for general purpose amplifier applications and is housed in the SOT-963 six-leaded surface mount package. By putting two discrete devices in one package, this device is ideal for low-power surface mount applications where board space is at a premium.
Features

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(3) (2) (1)

hFE, 200-450 Low VCE(sat), 0.3 V Simplifies Circuit Design Reduces Board Space Reduces Component Count This is a Pb-Free Device
Rating Symbol VCEO VCBO VEBO IC HBM MM ESD Class Value 45 50 6.0 100 2 B Unit Vdc Vdc Vdc mAdc

Q1

Q2

(4)

(5) NST847BPDP6T5G* *Q1 PNP Q2 NPN

(6)

MAXIMUM RATINGS
Collector -Emitter Voltage Collector -Base Voltage Emitter-Base Voltage Collector Current - Continuous Electrostatic Discharge

6

5

4

1

2

3

THERMAL CHARACTERISTICS
Characteristic (Single Heated) Total Device Dissipation TA = 25 C Derate above 25 C (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) Total Device Dissipation TA = 25 C Derate above 25 C (Note 2) Thermal Resistance, Junction-to-Ambient (Note 2) Characteristic (Dual Heated) (Note 3) Total Device Dissipation TA = 25 C Derate above 25 C (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) Total Device Dissipation TA = 25 C Derate above 25 C (Note 2) Thermal Resistance, Junction-to-Ambient (Note 2) Junction and Storage Temperature Range Symbol PD RqJA PD RqJA Symbol PD RqJA PD RqJA TJ, Tstg Max 240 1.9 520 280 2.2 446 Max 350 2.8 357 420 3.4 297 -55 to +150 Unit mW mW/ C C/W mW mW/ C C/W Unit mW mW/ C C/W mW mW/ C C/W C A M G

SOT-963 CASE 527AD PLASTIC

MARKING DIAGRAM
AMG G

1

= Device Code = Date Code = Pb-Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION
Device Package Shipping

NST847BPDP6T5G SOT-963 8000/Tape & Reel (Pb-Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-4 @ 100 mm2, 1 oz. copper traces, still air. 2. FR-4 @ 500 mm2, 1 oz. copper traces, still air. 3. Dual heated values assume total power is sum of two equally powered channels
Semiconductor Components Industries, LLC, 2008

May, 2008 - Rev. 0

1

Publication Order Number: NST847BPDP6/D


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