NTLJD3119C-D| Datasheet

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NTLJD3119C Power MOSFET
Features

20 V/-20 V, 4.6 A/-4.1 A, mCoolt Complementary, 2x2 mm, WDFN Package
Complementary N-Channel and P-Channel MOSFET WDFN Package with Exposed Drain Pad for Excellent Thermal
Conduction Footprint Same as SC-88 Package Leading Edge Trench Technology for Low On Resistance 1.8 V Gate Threshold Voltage Low Profile (< 0.8 mm) for Easy Fit in Thin Environments This is a Pb-Free Device
V(BR)DSS N-Channel 20 V

http://onsemi.com
RDS(on) MAX 65 mW @ 4.5 V 85 mW @ 2.5 V 120 mW @ 1.8 V 100 mW @ -4.5 V P-Channel -20 V 135 mW @ -2.5 V 200 mW @ -1.8 V ID MAX 3.8 A 2.0 A 1.7 A -4.1 A -2.0 A -1.6 A

Applications

Synchronous DC-DC Conversion Circuits Load/Power Management of Portable Devices like PDA's, Cellular
Phones and Hard Drives Color Display and Camera Flash Regulators

MAXIMUM RATINGS (TJ = 25 C unless otherwise noted)
Parameter Drain-to-Source Voltage Gate-to-Source Voltage N-Channel Continuous Drain Current (Note 1) P-Channel Continuous Drain Current (Note 1) Power Dissipation (Note 1) N-Channel Continuous Drain Current (Note 2) P-Channel Continuous Drain Current (Note 2) Power Dissipation (Note 2) Steady State t5s Steady State t5s Steady State t5s Steady State Steady State N-Ch P-Ch N-Ch P-Ch TA = 25 C TA = 85 C TA = 25 C TA = 25 C TA = 85 C TA = 25 C TA = 25 C TA = 25 C TA = 85 C TA = 25 C TA = 85 C PD IDM TJ, TSTG TL ID ID 2.3 2.6 1.9 -2.3 -1.6 0.71 18 -20 -55 to 150 260 W A Symbol VDSS VGS ID Value 20 -20 8.0 3.8 2.8 4.6 -3.3 -2.4 -4.1 1.5 Unit V

D1 WDFN6 CASE 506AN

MARKING DIAGRAM
1 2 3 JDMG G 6 5 4

Pin 1 V A

JD = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)

PIN CONNECTIONS
D1

S1 G1

1 2 D2 3

6 5 4

D1 G2 S2

A D2

(Top View)

Steady TA = 25 C State N-Ch Pulsed Drain Current tp = 10 ms P-Ch Operating Junction and Storage Temperature Lead Temperature for Soldering Purposes (1/8 from case for 10 s)

ORDERING INFORMATION
A C C Device NTLJD3119CTAG NTLJD3119CTBG Package WDFN6 (Pb-Free) WDFN6 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 2. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm2, 2 oz Cu.
Semiconductor Components Industries, LLC, 2007

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

August, 2007 - Rev. 2

Publication Order Number: NTLJD3119C/D