NTMS4700N-D| Datasheet

Datasheet preview, take a look at Datasheets before downloading (Data Sheet is available on manufacturer site)

NTMS4700N Power MOSFET
Features

30 V, 14.5 A, Single N-Channel, SO-8

Ultra Low RDS(on) (at 4.5 VGS), Low Gate Resistance and Low QG Optimized for High Side Control Applications High Speed Switching Capability Pb-Free Package is Available

http://onsemi.com
V(BR)DSS 30 V RDS(on) TYP 6.0 mW @ 10 V 7.3 mW @ 4.5 V D ID MAX 14.5 A

Applications

Notebook Computer Vcore Applications Network Applications DC-DC Converters
MAXIMUM RATINGS (TJ = 25 C unless otherwise noted)
Rating Drain-to-Source Voltage Gate-to-Source Voltage - Continuous Continuous Drain Current (Note 1) Steady State t v10 s Power Dissipation (Note 1) Continuous Drain Current (Note 2) Power Dissipation (Note 2) Pulsed Drain Current Steady State t v10 s TA = 25 C Steady State TA = 70 C TA = 25 C PD IDM TJ, Tstg IS EAS ID TA = 25 C TA = 70 C TA = 25 C PD TA = 25 C 2.5 8.6 6.8 0.86 40 -55 to 150 2.5 280 W A C A mJ A Symbol VDSS VGS ID Value 30 $20 11.5 9.2 14.5 1.56 W Unit V V A

8 1

SO-8 CASE 751 STYLE 12

MARKING DIAGRAM / PIN ASSIGNMENT
Source Source Source Gate 1 4700N AYWW G G 8 Drain Drain Drain Drain

tp = 10 ms

Operating and Storage Temperature Source Current (Body Diode) Single Pulse Drain-to-Source Avalanche Energy (VDD = 25 V, VGS = 10 V, IPK = 7.5 A, L = 10 mH, RG = 25 W) Lead Temperature for Soldering Purposes (1/8 in from case for 10 s)

Top View 4700N A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package

260

THERMAL RESISTANCE RATINGS
Rating Junction-to-Lead - Steady State Junction-to-Ambient - Steady State (Note 1) Junction-to-Ambient - t v10 s (Note 1) Junction-to-Ambient - Steady State (Note 2) Symbol RqJL RqJA RqJA RqJA Value 16 80 50 145 Unit C/W

(Note: Microdot may be in either location)

ORDERING INFORMATION
Device NTMS4700NR2 NTMS4700NR2G Package SO-8 SO-8 (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Surface-mounted on FR4 board using 1 in sq. pad size (Cu area 1.127 in sq. [1 oz] including traces). 2. Surface-mounted on FR4 board using minimum recommended pad size (Cu area 0.412 in sq.).

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2006

August, 2006 - Rev. 4

Publication Order Number: NTMS4700N/D