rej03b0097_r8c2223ds| Datasheet

By datasheet - March 1st, 2009

rej03b0097_r8c2223ds| Datasheet

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R8C/22 Group, R8C/23 Group
RENESAS MCU

REJ03B0097-0200 Rev.2.00 Aug 20, 2008

Overview

This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group. The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same.

1.1

Applications

Automotive, etc.

Rev.2.00 Aug 20, 2008 REJ03B0097-0200

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