DSILC6-4F2| Datasheet

DSILC6-4F2, DSILC6-4P6, DSILC6-4xx

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DSILC6-4xx
ESD Protection for high speed interface
Main applications
Where transient over-voltage protection in ESD sensitive equipment is required, such as:

I/O3 VCC I/O4 I/O2 GND I/O1

Computers Printers Communication systems Cell phone handsets and accessories Video equipment

SOT-666 DSILC6-4P6

Flip-Chip DSILC6-4F2

Functional diagram

Description
The DSILC6-4xx is a monolithic application specific discrete dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet, display and camera serial interfaces (LVDS).

I/O4

VCC

I/O3

I/O1

VCC

I/O2

I/O4
I/O1 GND I/O2

GND

I/O3

The device is ideal for applications where both reduced printed circuit board space and power absorption capability are required.

SOT-666 Top-side view

Flip-Chip Top-side view

Features
Diode array topology

I/O1 I/O4

VCC GND

I/O2 I/O3

4 line protection 5 V VCC protection Very low capacitance: 1 pF typ. Lead-free pacakge RoHS compliant

Flip-Chip Top-side view

Order Code
Part Number DSILC6-4P6 DSILC6-4F2 Marking G EI

Benefits

Very low capacitance between lines to GND for optimized data integrity Low PCB space consumption: 2.9 mm max for SOT-666 and 1.5 mm max for Flip-Chip Cut-off frequency > 2 GHz High reliability offered by monolithic integration MDDI, SMIA, MIPI specification compliant

Complies with the following standards:
IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class 3B

May 2007

Rev 3

1/11
www.st.com 11


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