EMIF03-SIM02C2| Datasheet

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EMIF03-SIM02C2
IPADTM 3 line EMI filter including ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is required:

SIM Interface (Subscriber Identify Module) UIM Interface (Universal Identify Module)

Description
The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV.

Coated Flip-Chip package (8 bumps)

Pin configuration (Bump side)
3
RST in

Benefits

2
RST ext

1 A
CLK ext

EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free coated package Very low PCB space consuming: 1.42mm x 1.42mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging

CLK in

Gnd

B C

Data in

VCC

Data ext

Complies with following standards:
IEC 61000-4-2
Level 4 on external and VCC pins: 15 kV 8 kV Level 1 on internal pins: 2 kV 2 kV (air discharge) (contact discharge (air discharge) (contact discharge

MIL STD 883G - Method 3015-7 Class 3

March 2007

Rev 2

1/8
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