EMIF06-10006C2| Datasheet

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EMIF06-10006C2
IPADTM 6 line EMI filter and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is required:

Mobile phones and communication systems Computers, printers and MCU Boards

Description
The EMIF06-10006C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMIF filters. Flip-Chip (15 Bumps)

Order Code
Part Number EMIF06-10006C2 Marking FT

Benefits

Figure 1.

Pin Configuration (bump side)

EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free coated package Very low PCB space consumption 2.92 mm x 1.29 mm Very thin package: 0.695 mm High efficiency in ESD suppression (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging
O6 O5 O4 O3 O2 O1
C 9 8 7 6 5 4 3 2 1

I6 Gnd

I4 Gnd

I2 Gnd

A B

Complies with the following standards:
IEC 61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3: 30 kV

TM: IPAD is a trademeark of STMicroelectronics

November 2006

Rev 1

1/9
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