EMIF06-AUD01F2| Datasheet

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EMIF06-AUD01F2
6-line EMI filter and ESD protection for audio interface
Features

4-line EMI filter and ESD protection for internal and external (headset) microphone 2-line EMI filter and ESD protection for headset speaker

Benefits

EMI (I/O) low-pass filter High efficiency EMI filter Very low PCB space consumption: 4.6 mm2 Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging
Flip chip package, 20 bumps

Description
The EMIF06-AUD01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Figure 1. Pin configuration
1 2
MIC2N

Complies with following standards

IEC 61000-4-2 level 4 external pins 15 kV (air discharge) 8 kV (contact discharge) IEC 61000-4-2 level 1 internal pins 2 kV (air discharge) 2 kV (contact discharge)

Applications
3
MIC2P

4
SPK_R

5
SPK_L

ESD protection and EMI/RFI filtering for the audio bottom connector interface, where EMI filtering in ESD sensitive equipment is required:

A B C D

MIC1P

Mobile phones and communication systems Wireless modules

MIC1N

BIAS1

GND Int

HOOK

GND

GND

MIC1P int

MIC2N int

BIAS2

SPK_L int

MIC1N int

BIAS3

MIC2P int

SPK_R int

PHG

Silicon side

February 2008

Rev 1

1/14
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EMIF06-AUD01F2 DATASHEET