EMIF08-VID01C2| Datasheet

EMIF08-VID01C2| Datasheet

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EMIF08-VID01C2
8 line low capacitance EMI filter and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is required:

LCD and camera for mobile phones Computers and printers Communication systems MCU Boards

Description
The EMIF08-VID01C2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.
12 11 10 9 8 7 I6
GND

Coated Flip-Chip package

Pin configuration (Bump side)

6 5 4 I4
GND

3 2 1 I2
GND

Benefits

I8
GND

I7

I5

I3

I1

A B C

High efficiency EMI filter (-33 dB @ 900 MHz) Low line capacitance suitable for high speed data bus Low serial resistance for camera impedance adaptation Optimized PCB space consuming: 1.29 mm x 3.92 mm Very thin package: 0.695 mm Coating resin on back side and lead free package High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4). High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging.
O8

O7

O6

O5

O4

O3

O2

O1

Complies with following standards:
IEC 61000-4-2
level 4 input pins 15 kV 8 kV level 1 output pins 2 kV 2 kV (air discharge) (contact discharge (air discharge) (contact discharge

MIL STD 883E - Method 3015-6 Class 3

October 2006

Rev 4
www.st.com

1/6


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