EMIF10-COM01C2| Datasheet
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EMIF10-COM01C2
IPADTM EMI Filter including ESD protection
Main product characteristics
EMI filtering and ESD protection for:
Computers and printers Communication systems Mobile phones Lead free coated Flip-Chip (25 Bumps)
Description
The EMIF10-COM01C2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.
Order code
Part Number EMIF10-COM01C2 Marking FE
Figure 1.
Pin configuration (Bump side)
5
I5
Benefits
4
I4
3
I3
2
I2
1
I1
EMI symmetrical (I/O) low-pass filter Coating resin on flat side Very low PCB space consuming: < 6 Very thin package: 0.65 mm High efficiency in ESD suppression on both input and output pins High reliability offered by monolithic integration Lead free package Figure 2. Basic cell configuration
Low-pass Filter
I10 I9 I8 I7 I6
A B C D E
mm2
GND GND GND GND GND
010
09
08
07
06
05
04
03
02
01
Complies with the following standards:
IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge)
Input
Output
TM: IPAD is a trademark of STMicroelctronics
RI/O = 200 Cline = 45 pF
April 2006
Rev4
1/7
www.st.com 7
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