ESDAULC6-3BF2| Datasheet

ESDAULC6-3BF2, ESDAULC6-3BP6

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ESDAULC6-3BP6 ESDAULC6-3BF2
ESD protection for high speed interface
Main applications
Where transient overvoltage protection in ESD sensitive equipment is required, such as:

Computers Printers Communication systems Cellular phones handsets and accessories Video equipment
SOT-666 ESDAULC6-3BP6 Flip-Chip ESDAULC6-3BF2

Figure 1.

Functional diagram
A B
GND

Features

Ultra low capacitance 1.25 pF max. Bi-directional protection RoHS package

I/O1 NC I/O2

1 2 3

6 5 4

GND NC I/O3

I/O1

I/O2

I/O3

Description
The ESDAULC6-3Bxx is a monolithic application specific discrete device dedicated to ESD protection of high speed interfaces such as USB2.0. The device is ideal for applications where both reduced print circuit board space and power absorption capability are required.

Top view ESDAULC6-3BP6

Bump side view ESDAULC6-3BF2

Figure 2.

Pin configuration
I/O1 I/O2 I/O3

Benefits

GND

Ultra low capacitance bidirectional ESD protection Low PCB space consumption: 2.5 mm2 max footprint (1.7 mm2 for Flip-Chip) Enhanced ESD protection: 15 kV contact discharge 15 kV air discharge No insertion loss to 3.0 GHz Ultra low leakage current High reliability offered by monolithic integration

Table 1.

Order codes
Marking 3 3B

Part number ESDAULC6-3BP6 ESDAULC6-3BF2

Complies with the following standards:
IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class 3B HBM (Human Body Model)

July 2007

Rev 1

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