STG4259| Datasheet

STG4259, STG4259BJR

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STG4259
Low voltage 0.3 max dual SPDT switch with break-before-make feature and 15KV ESD protection
Features

Wide operating voltage range: VCC (Opr) = 1.65 V to 4.8 V Low power dissipation: ICC = 0.2 uA (max) at TA = 85 C Low ON resistance VIN = 0V: RON = 0.4 (max TA = 25 C) at VCC = 2.25 V RON = 0.35 (max TA = 25 C) at VCC = 3.0 V RON = 0.30 (max TA = 25 C) at VCC = 4.3 V Separate supply voltage for switch and control pin Separate control pin for each switch Latch-up performance exceeds 100 mA per JESD 78, class II ESD performance tested on common channels (D1 and D2 pins) 9 kV IEC-61000-4-2 ESD, contact discharge 15 kV IEC-61000-4-2 ESD, air gap discharge ESD performance tested on all other pins 8 kV IEC-61000-4-2 ESD, contact discharge 500 V machine model (JESD22 A115-A) 1500 V charged-device model (JESD22 C101) 8 kV IEC-61000-4-2 ESD, air gap discharge

Flip-Chip11

Description
The STG4259 is a high-speed CMOS low voltage dual analog SPDT (single pole dual throw) switch or 2:1 multiplexer/ demultiplexer switch fabricated in silicon gate C2MOS technology. It is designed to operate from 1.65 V to 4.8 V, making this device ideal for portable applications. It offers low ON resistance (0.30 ) at VCC = 4.3 V. The SEL inputs are provided to control the switches. The switch S1 is ON (connected to common port D) when the SEL input is held high and OFF (high impedance state exists between the two ports) when SEL is held low; the switch S2 is ON (it is connected to common port D) when the SEL input is held low and OFF (high impedance state exist between the two ports) when SEL is held high. Additional key features are fast switching speed, break-before-make delay time and ultra low power consumption. All inputs and outputs are equipped with protection circuits against static discharge, giving them ESD immunity and transient excess voltage.

Table 1.

Device summary
Order code STG4259BJR Package Flip-Chip11 Packing Tape and Reel

August 2007

Rev 4

1/19
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