LVC3G07-1_8| Datasheet

LVC3G07-1_8, LVC3G07-2_5, LVC3G07-3_3, LVC3G07-5_0

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SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365J AUGUST 2001 REVISED FEBRUARY 2007

FEATURES
Available in the Texas Instruments NanoFreeTM Package Supports 5-V VCC Operation Max tpd of 3.7 ns at 3.3 V Low Power Consumption, 10-uA Max ICC 24-mA Output Drive at 3.3 V Input and Open-Drain Output Accepts Voltages up to 5.5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25 C
DCT PACKAGE (TOP VIEW)

Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25 C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
YZP PACKAGE (BOTTOM VIEW)

DCU PACKAGE (TOP VIEW)

1A 3Y 2A GND

1 2 3 4

8 7 6 5

VCC 1Y 3A 2Y

1A 3Y 2A GND

1 2 3 4

8 7 6 5

VCC 1Y 3A 2Y

GND 2A 3Y 1A

4 5 3 6 2 7 1 8

2Y 3A 1Y VCC

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION
TA PACKAGE (1) NanoFreeTM WCSP (DSBGA) 0.23-mm Large Bump YZP (Pb-free) 40 C to 85 C SSOP DCT VSSOP DCU (1) (2) Reel of 3000 Reel of 3000 Reel of 3000 Reel of 250 ORDERABLE PART NUMBER SN74LVC3G07YZPR SN74LVC3G07DCTR SN74LVC3G07DCUR SN74LVC3G07DCUT TOP-SIDE MARKING (2) _ _ _CV C07_ _ _ C07_

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.