TLV4113-EP| Datasheet

Datasheet preview, take a look at Datasheets before downloading (Data Sheet is available on manufacturer site)

TLV4110-EP, TLV4111-EP TLV4112-EP, TLV4113-EP
www.ti.com............................................................................................................................................................... SGLS314D JUNE 2006 REVISED MAY 2008

HIGH-OUTPUT-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
1

FEATURES

Controlled Baseline One Assembly Site One Test Site One Fabrication Site Extended Temperature Performance of 55 C to 125 C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) High Output Drive . . . >300 mA Rail-To-Rail Output Unity-Gain Bandwidth . . . 2.7 MHz Slew Rate . . . 1.5 V/us Supply Current . . . 700 uA/Per Channel Supply Voltage Range . . . 2.5 V to 6 V Universal Op Amp EVM
23

TLV4112 D OR DGN PACKAGE (TOP VIEW)

1OUT 1IN- 1IN+ GND

1 2 3 4

8 7 6 5

VDD 2OUT 2IN- 2IN+
P0029-01

DESCRIPTION
The TLV411x single-supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110 and TLV4113 come with a shutdown feature. The TLV411x is available in the ultra-small MSOP PowerPADTM package, which offers the exceptional thermal impedance required for amplifiers delivering high current levels. All TLV411x devices are offered in SOIC (single and dual) and MSOP PowerPAD (dual).

(1)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. PACKAGE TYPES MSOP 8 8 8 10 SOIC 8 8 8 14

FAMILY PACKAGE TABLE
DEVICE TLV4110 TLV4111 TLV4112 TLV4113 NUMBER OF CHANNELS 1 1 2 2 SHUTDOWN Yes Yes See the EVM Selection Guide (SLOU060) UNIVERSAL EVM BOARD

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Parts, Microsim PSpice are trademarks of MicroSim Corporation.
Copyright 2006 2008, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.