TPA701| Datasheet

TPA701| Datasheet

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TPA701 700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D NOVEMBER1998 REVISED MAY 2003

D Fully Specified for 3.3-V and 5-V Operation D Wide Power Supply Compatibility D D D D
2.5 V 5.5 V Output Power for RL = 8 700 mW at VDD = 5 V, BTL 250 mW at VDD = 3.3 V, BTL Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA Thermal and Short-Circuit Protection Surface-Mount Packaging SOIC PowerPAD MSOP

D OR DGN PACKAGE (TOP VIEW)

SHUTDOWN BYPASS IN+ IN

1 2 3 4

8 7 6 5

VO GND VDD VO +

description
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

VDD 6 RF Audio Input RI CI 4 3 IN IN+ VDD/2 VO+ 5 CS +

VDD

2 CB

BYPASS

+

VO 8 7 GND

700 mW

From System Control

1

SHUTDOWN

Bias Control

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1998 2003, Texas Instruments Incorporated

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

1


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