73463| Datasheet
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Si5938DU
Vishay Siliconix
Dual N-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) 20 RDS(on) () 0.039 at VGS = 4.5 V 0.045 at VGS = 2.5 V 0.055 at VGS = 1.8 V ID (A)a 6 6 6 6 nC Qg (Typ.)
FEATURES
Halogen-free TrenchFET Power MOSFET New Thermally Enhanced PowerPAK ChipFET Package - Small Footprint Area - Low On-Resistance - Thin 0.8 mm Profile
RoHS
COMPLIANT
PowerPAK ChipFET Dual
1
S1 G1 D1
APPLICATIONS
2 3
S2
Marking Code CA XXX Lot Traceability and Date Code Part # Code
G2
Load Switch for Portable Applications DC-DC Point-of-Load D1
D2
8 7
D1 D2
4
6 5
D2
G1
G2
Bottom View
S1 N-Channel MOSFET
S2 N-Channel MOSFET
Ordering Information: Si5938DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 C TC = 70 C TA = 25 C TA = 70 C TC = 25 C TA = 25 C TC = 25 C TC = 70 C TA = 25 C TA = 70 C Symbol VDS VGS ID IDM IS Limit 20 8 6a 6a 7.2b, c 5.8b, c 20 6.9 1.9b, c 8.3 5.3 2.3b, c 1.5b, c - 55 to 150 260 Unit V
Continuous Drain Current (TJ = 150 C)
A
Pulsed Drain Current Continuous Source-Drain Diode Current
Maximum Power Dissipation
PD TJ, Tstg
W
Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e
C
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t5s Steady State Symbol RthJA RthJC Typical 45 12 Maximum 55 15 Unit C/W
Notes: a. Package limited. b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 s. d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 105 C/W. Document Number: 73463 S-81449-Rev. B, 23-Jun-08 www.vishay.com 1

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