80094| Datasheet

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VISHAY
Vishay Semiconductors

Component Construction
LEDs
The basis for an LED is a lead frame with treated surface. The chips are mounted in a reflecting tray in order to increase the light output. The contacts are made on the cathode side by means of conductive adhesive and on the anode side via a gold wire to the lead frame. The plastic case encloses the chip area of the lead frame and determines the radiation characteristics as an optical system. The special plastic material provides the component with high resistance against moisture and mechanical effects.
IRED Chip AU-Bond Wire LED Chip Reflector Reflector

Displays
The LED chips are mounted with conductive adhesive on a lead frame. This frame is cast into the display housing which, with its highly reflective light channels, simultaneously provides the external and the segment configuration. This construction provides the display with special characteristics: wide operating temperature range, protection against environmental effects; uniform, bright segment illumination; resistance to shock and vibration.

AU-Bond Wire Resistor Chip

Plastic Package

Lead Frame Lead Frame

96 1 1620

Anode

Cathode

Figure 2. Resistor LED design

94 8314

Figure 1. Standard LED design

Document Number: 80094 Rev. 1.2, 20-Aug-04

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