85810| Datasheet

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BZD27C3V6P to BZD27C200P
Vishay Semiconductors

Zener Diodes with Surge Current Specification

Features
Sillicon Planar Zener Diodes Low profile surface-mount package e3 Zener and surge current specification Low leakage current Excellent stability High temperature soldering: 260 C/10 sec. at terminals Lead (Pb)-free component Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

17249

Mechanical Data
Case: JEDEC DO-219AB Weight: approx. 15 mg (SMF ) Plastic case

Packaging codes/options: GS18 / 10 k per 13 " reel, (8 mm tape), 50 k/box GS08 / 3 k per 7 " reel, (8 mm tape), 30 k/box

Absolute Maximum Ratings
Tamb = 25 C, unless otherwise specified Parameter Power dissipation Test condition TL = 80 C TA = 25 C Non-repetitive peak pulse power 100 us square pulse2) dissipation 10/1000 us waveform (BZD27C7V5P to BZD27-C100P)2) 10/1000 us waveform (BZD27C110P to BZD27-C200P)2)
1) 2)

Symbol Ptot Ptot PZSM PRSM PRSM

Value 2.3 0.8
1)

Unit W W W W W

300 150 100

Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40 um thick) TJ = 25 C prior to surge

Thermal Characteristics
Tamb = 25 C, unless otherwise specified Parameter Thermal resistance junction to ambient Thermal resistance junction to lead Maximum junction temperature Storage temperature range
1)

Test condition air1)

Symbol RthJA RthJL Tj TS

Value 180 30 150 - 55 to + 150

Unit K/W K/W C C

Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40 um thick)

Electrical Characteristics
Tamb = 25 C, unless otherwise specified Parameter Forward voltage Document Number 85810 Rev. 1.8, 13-Apr-05 Test condition IF = 0.2 A Symbol VF Min Typ. Max 1.2 Unit V www.vishay.com 1