cmb0207| Datasheet

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CMB 0207
Vishay Beyschlag

High Pulse Load MELF Resistor
FEATURES
Approved to the safety requirements of

REG.-Nr. B583

IEC 60065, 14.1.a* (= VDE 0860, 14.1.a) VDE-REG.-Nr. B583 Special carbon film technology Up to 10 kV or 17 kW single pulse capability Up to tbf. continuous pulse load capability ESD capability: 16 kV, Human Body Model Compatible with lead (Pb)-free and lead containing soldering processes Lead (Pb)-free and RoHS compliant

APPLICATIONS
CMB 0207 speciality MELF resistors with advanced pulse load capability are the perfect choice for the protection of circuitry with signal and mains input lines from surge pulses. The resistors are also suitable for circuits exposed to high levels of electromagnetic interference or electro-static discharge. The applications are in all fields of automotive, telecommunication, industrial and medical equipment. Automotive Telecommunication Industrial Medical equipment

METRIC SIZE
DIN: CECC: 0207 RC 6123M

TECHNICAL SPECIFICATIONS
DESCRIPTION CECC size Resistance range Resistance tolerance Temperature coefficient Operation mode Climatic category (LCT/UCT/days) Rated dissipation, P701) Operating voltage, Umax AC/DC Film temperature3) Max. resistance change at P70 for resistance range, |R/R| after: 1000 h 8000 h 225 000 h Permissible voltage against ambient (insulation): 1 minute; Uins continuous Failure rate 750 V 75 V 1 10-9/h 0.5 % 1% t.b.f 125 C 2.2 to 10 k 1% 2% standard 55/125/56 0.4 W 500 V 155 C CMB 0207 RC 6123M 2.2 to 1.5 M 5 %; 2 % see TCR graph power 55/155/56 1.0 W

Notes These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. 1. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heatflow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. 2. Specified power rating requires dedicated heat-sink pads. 3. Film temperatures above the specified range may be permissible, e.g. 175 C. Please contact the factory for details. Document Number: 28755 Revision: 31-Oct-06 For technical questio
ns, contact: ff3bresistors@vishay.com www.vishay.com 79